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XC3S50 Programmable IC Chips Spartan-3 FPGA Field-Programmable Gate Arrays

XC3S50 Programmable IC Chips Spartan-3 FPGA Field-Programmable Gate Arrays

Brand Name : Anterwell
Model Number : XC3S50
Certification : new & original
Place of Origin : original factory
MOQ : 10pcs
Price : Negotiate
Payment Terms : T/T, Western Union, Paypal
Supply Ability : 6300pcs
Delivery Time : 1 day
Packaging Details : Please contact me for details
Internal supply voltage relative to GND : –0.5 to 1.32 V
Auxiliary supply voltage relative to GND : –0.5 to 3.00 V
Output driver supply voltage relative to GND : –0.5 to 3.75 V
Input reference voltage relative to GND : –0.5 to VCCO + 0.5 V
Junction temperature : 125 °C
Soldering temperature : 220 °C
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Spartan-3 FPGA Family


Introduction

The Spartan®-3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The eight-member family offers densities ranging from 50,000 to five million system gates, as shown in Table 1.


The Spartan-3 family builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from the Virtex®-II platform technology. These Spartan-3 FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.


Because of their exceptionally low cost, Spartan-3 FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection and digital television equipment.


The Spartan-3 family is a superior alternative to mask programmed ASICs. FPGAs avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.


The Spartan-3 FPGAs are the first platform among several within the Spartan-3 Generation FPGAs.



Features

• Low-cost, high-performance logic solution for high-volume, consumer-oriented applications

- Densities up to 74,880 logic cells

• SelectIO™ interface signaling

- Up to 633 I/O pins

- 622 Mb/s data transfer rate per I/O

- 18 single-ended signal standards

- 8 differential I/O standards including LVDS, RSDS

- Termination by Digitally Controlled Impedance

- Signal swing ranging from 1.14V to 3.465V

- Double Data Rate (DDR) support

- DDR, DDR2 SDRAM support up to 333 Mbps


• Logic resources

- Abundant logic cells with shift register capability

- Wide, fast multiplexers

- Fast look-ahead carry logic

- Dedicated 18 x 18 multipliers

- JTAG logic compatible with IEEE 1149.1/1532

• SelectRAM™ hierarchical memory

- Up to 1,872 Kbits of total block RAM

- Up to 520 Kbits of total distributed RAM


• Digital Clock Manager (up to four DCMs)

- Clock skew elimination

- Frequency synthesis

- High resolution phase shifting

• Eight global clock lines and abundant routing

• Fully supported by Xilinx ISE® and WebPACK™ software development systems

• MicroBlaze™ and PicoBlaze™ processor, PCI®, PCI Express® PIPE Endpoint, and other IP cores

• Pb-free packaging options

• Automotive Spartan-3 XA Family variant


Absolute Maximum Ratings

SymbolDescriptionConditionsMinMaxUnits
VCCINTInternal supply voltage relative to GND–0.51.32V
VCCAUXAuxiliary supply voltage relative to GND–0.53.00V
VCCOOutput driver supply voltage relative to GND–0.53.75V
VREFInput reference voltage relative to GND–0.5VCCO + 0.5V
VINVoltage applied to all User I/O pins and Dual-Purpose pins relative to GND(2, 4)Driver in a high-impedance stateCommercial–0.954.4V
Industrial–0.854.3V
Voltage applied to all Dedicated pins relative to GND(3)All temp. ranges–0.5VCCAUX + 0.5V
IIKInput clamp current per I/O pin–0.5 V < VIN < (VCCO + 0.5 V)±100mA
VESDElectrostatic Discharge Voltage pins relative to GNDHuman body model±2000V
Charged device model±500V
Machine model±200V
TJJunction temperature125°C
TSOLSoldering temperature220°C
TSTGStorage temperature–65150°C

Notes:

1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions beyond those listed under the Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time adversely affects device reliability.


2. All User I/O and Dual-Purpose pins (DIN/D0, D1–D7, CS_B, RDWR_B, BUSY/DOUT, and INIT_B) draw power from the VCCO power rail of the associated bank. Keeping VIN within 500 mV of the associated VCCO rails or ground rail ensures that the internal diode junctions that exist between each of these pins and the VCCO and GND rails do not turn on. Table 31 specifies the VCCO range used to determine the max limit. Input voltages outside the -0.5V to VCCO+0.5V voltage range are permissible provided that the IIK input clamp diode rating is met and no more than 100 pins exceed the range simultaneously. The VIN limits apply to both the DC and AC components of signals. Simple application solutions are available that show how to handle overshoot/undershoot as well as achieve PCI compliance. Refer to the following application notes: "Powering and Configuring Spartan-3 Generation FPGAs in Compliant PCI Applications" (XAPP457) and "Virtex®-II Pro / Virtex-II Pro X 3.3V I/O Design Guidelines” (XAPP659).


3. All Dedicated pins (M0–M2, CCLK, PROG_B, DONE, HSWAP_EN, TCK, TDI, TDO, and TMS) draw power from the VCCAUX rail (2.5V). Meeting the VIN max limit ensures that the internal diode junctions that exist between each of these pins and the VCCAUX rail do not turn on. Table 31 specifies the VCCAUX range used to determine the max limit. When VCCAUX is at its maximum recommended operating level (2.625V), VIN max < 3.125V. As long as the VIN max specification is met, oxide stress is not possible. For information concerning the use of 3.3V signals, see the 3.3V-Tolerant Configuration Interface, page 46See XAPP459, “Eliminating I/O Coupling Effects when Interfacing Large-Swing Single-Ended Signals to User I/O Pins.”


4. For soldering guidelines, see "Device Packaging and Thermal Characteristics" (UG112) and "Implementation and Solder Reflow Guidelines for Pb-Free Packages" (XAPP427).


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